Lamination & PressingCCL & Insulation Materials
Solution for Aluminum Base Copper Clad Laminate Press
copper clad laminates press, ccl production system, ccl trimmer, ccl stacking and inspection system, fiber glass impregnation, fiber glass epoxy impregnation,
NTRY Engineering Team1 min read
Basic Structure
Instruction
Circuit Layer: Electrolysis copper foil
Thermal Conductive Dielectric Layer: This offers electrical isolation with minimum thermal resistance. Two types: Fiberglass support& non-fiberglass support.
Aluminum Substrate: It supports the entire structure and conducts the heat. The material is aluminum alloy plate.
Single Al-Substrate CCL
Single Al-Substrate CCL offers various kinds of aluminum alloy plate, copper foil and dielectric layers to meet the general requirement of single-layer thermally conductive printed circuit board.
Double Al-Substrate CCL
